Potting is the process of completly filling an electronic
assembly with a solid compound for helping it resistance to
shock and vibration and for exclusion of moisture and corrosive
agents. Thermo-setting plastics or silicone rubber gels are
THE industry standard for years given its many challenges.
They include: limited design options, limited material options,
thermal expansion problems, subjective process fraught with
human error, re-enter ability problems given risks associated
with potential board damage, not re-usable and is labor
intensive, to name a few.
While heat pads have been a standard for years engineers and
designers often find their hands tied when they need to design
their products around design and material limitations associated
with heat pads.
An Ulti-Pak™preform is a two-layer composite structure. The
inner layer surrounds electronic assemblies (such as PC boards,
batteries or sensors) with a soft visco elastic silicone
Ulti-Pads™are made from a highly thermally conductive
vibration damped visco elastic material designed to provide
mechanical support of an electronics assembly, while reducing
the thermal rise of electronic components within that assembly..